Package substrate edge coating system
Coating the substrate side with resin! Expected to suppress the occurrence of product defects.
We would like to introduce our "Package Circuit Board Edge Coating System." The system features separate coating heads that move simultaneously along the edges of the circuit board, applying a liquid agent with a uniform film thickness, adjustable to approximately 20 to 40 microns or more. Additionally, we offer a "Coating Device for Smart Glass" that can precisely and uniformly coat areas smaller than 1mm. 【Features of the Package Circuit Board Edge Coating System】 ■ Developed for the purpose of sealing dust on printed circuit boards ■ Coating the sides of the circuit board with resin helps to suppress product defects ■ Film thickness is adjustable to approximately 20 to 40 microns or more *For more details, please refer to the PDF document or feel free to contact us.
- Company：エナテック
- Price：Other
